高阻隔陶瓷薄膜包装材料的研究进展及关键技术  

Research of High-Barrier Ceramic Film Packaging Materials and Key Technologies

作　　者：孙智慧[1,2] 刘壮[1] 智慧[1] 林晶[1] 

机构地区：[1]哈尔滨商业大学轻工学院,哈尔滨150028 [2]黑龙江省生物产业软包装材料工程技术研究中心,哈尔滨150028

出　　处：《中国印刷与包装研究》2010年第1期1-8,共8页China Printing Materials Market

基　　金：国家"十一五"科技支撑计划资助项目(No.2006BAD05A05)

摘　　要：本文总结了高阻隔陶瓷薄膜包装材料制造技术的发展进程,介绍了各种镀膜方法及特点;系统综述了国内外AlO_x、SiO_x薄膜的研究进展与应用现状,分析了陶瓷薄膜包装材料制造过程中影响阻隔性能的主要因素,研究了提高薄膜阻隔性的基本措施,由此展望了高阻隔陶瓷薄膜包装材料发展及应用前景。In this paper,the high-barrier ceramic film packaging materials manufacturing technology development process was summarized.A variety of coating methods and characteristics were introduced.Research progress and application status of AlOx and SiOx film at home and abroad were overviewed.By analysing the main factors affecting the barrier properties during ceramic film packaging material manufacturing processes,the basic measures which can improve barrier properties were studied.Lastly,the development and application prospects of the high-barrier ceramic film packaging materials are made.

关 键 词：高阻隔 陶瓷薄膜 磁控溅射 

分 类 号：TB484.5[一般工业技术—包装工程]