助焊剂的正确使用和免清洗技术要点  

Key Points of Correct Use of Welding Flux of and Absolution Clean Technique

作　　者：齐成 

机构地区：[1]福建福州350012

出　　处：《印制电路信息》2010年第3期60-64,共5页Printed Circuit Information

摘　　要：在印制电路板制作中离不开焊锡等焊接工艺,它对印制电路板最终的质量影响极大。为保证焊接工艺的顺利进行,在操作中通常要使用助焊剂。文章主要探讨助焊剂的正确选用和对助焊剂使用中残留物的处理技术,即免清洗技术的操作要点。In the printed circuit board manufacturing the process of welding is key to the quality of PCB assembled. To assure good soldering, the welding flux is used. This paper discusses the correct choose and use of welding flux as well as treatment of solder remains, the key points of absolution clean technique.

关 键 词：印制电路板 助焊剂 免清洗技术 

分 类 号：TN41[电子电信—微电子学与固体电子学]