标准互连线性能参数的测试结构设计与实现  

Test Structures Design and Realization of Standard Interconnect Performance Parameters

作　　者：张永红[1] 毕烨[1] 冯培昌[1] 

机构地区：[1]上海第二工业大学实验与实训中心,上海201209

出　　处：《半导体技术》2010年第3期272-276,共5页Semiconductor Technology

摘　　要：标准互连线性能参数SIPPs是衡量ULSI后段制程效能的标准方法。结合纳米工艺后段制程的特点,根据各参数对不同测试结构敏感度的差异,设计了平行板电容、层跃平行板电容、叉指型电容、叉指型通孔链电阻等提取各参数的无源测试结构。结合版图层信息文件和测试结构输入文件,采用高阶Perl语言将其自动实现为CIF格式版图文件;经Cadence版图软件转换成晶圆厂广泛采用的GDSII格式文件并通过电学连接检查,极大地提高了测试结构设计和实现的效率。Standard interconnection performance parameters （SIPPs） is a standard method to measure ULSI back-end-of-line （BEOL） performance. Considering the BEOL features of nano-technology and the sensitivity differences of each parameter to different test structures, parallel plate, layer - skipping parallel plate, comb meander, comb meander for via resistance test structures were designed to extract SIPPs. Based on the process characteristics during manufacture of BEOL, it can be automatically realized in CIF format file with high - level Perl language connect with layout layer information and test structures input file, then change to GDSII format file that widely used in wafer foundry by Cadence layout software, and pass electrical rule checks. It greatly improves the efficiency of test structure design and realization.

关 键 词：互连线 SIPPs参数 测试结构设计 自动实现 

分 类 号：TN407[电子电信—微电子学与固体电子学]