低温共烧陶瓷技术(LTCC)与低介电常数微波介质陶瓷  

Low Temperature Co-fired Ceramic (LTCC) Technology and Low Permittivity Microwave Dielectric Ceramics

作　　者：李冉[1] 傅仁利[1] 何洪[1] 宋秀峰[1] 俞晓东[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《材料导报》2010年第5期40-44,共5页Materials Reports

摘　　要：简述了低温共烧陶瓷技术(LTCC)的特点及微波介质陶瓷实现低温共烧的性能要求,重点介绍了LTCC低介电常数微波介质陶瓷的分类及微波介电性能,分析和讨论了LTCC低介电常数微波介质陶瓷存在的问题,针对LTCC低介电常数陶瓷材料今后的发展方向提出了自己的看法。Characteristics of LTCC technology and property requirements of low permittivity microwave dielectries for LTCC applications are discussed. The main purpose of this review is to summarize the classification of low permittivity microwave dielectrics for LTCC applications and to make a comparison of their microwave dielectric pro- perties. Additionally, existing problems and the future prospects of the low temperature co-fired low permittivity microwave dielectrics are discussed.

关 键 词：微波介质陶瓷 LTCC 介电性能 低介电常数 

分 类 号：TQ174.756[化学工程—陶瓷工业] TN41[化学工程—硅酸盐工业]