AlN陶瓷活性封接技术的研究概况  

Study status guo on active brazing technology of AlN ceramics

作　　者：李慧[1] 秦明礼[1] 钟小婧[1] 张玲艳[1] 贾宝瑞[1] 曲选辉[1] 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083

出　　处：《粉末冶金材料科学与工程》2010年第1期8-14,共7页Materials Science and Engineering of Powder Metallurgy

基　　金：国家重点基础研究发展规划(973)资助项目(2006CB605207)

摘　　要：AlN陶瓷具有优异的热、电、力学等综合性能,在许多高技术领域具有广泛的应用前景。但由于AlN陶瓷的一些固有特性限制,通常需要与其他材料封接后才能使用。AlN陶瓷与其他材料封接的方法很多,在诸多的封接方法中,活性金属法以其适用面广、连接强度高、工艺简单、高效可靠等优点引人注目。该文主要介绍近年来AlN陶瓷活性封接技术的研究状况,包括在活性钎料、反应润湿、界面反应、连接强度及与其他材料封接等方面的研究状况,指出有待进一步研究的问题。Aluminum nitride （AlN） possesses excellent thermal,electrical and mechanical properties,and attracts more and more attention in a lot of high tech domains. However in many applications,it needs to be braz with other materials due to the limitation of its intrinsic property. Among the methods of brazing of AlN ceramics-to-other materials,the merits of active brazing are obvious,such as broad in application,high in bonding strength,simple in process,easy for controlling and high efficiency in industry production. Beside,the most excellent priority is that the ceramics need not to be metalized before packaging. The present paper relates the status quo and progress of the active brazing technology of AlN ceramics-to-other materials,including active brazing material,reaction wetting,interfacial reactivity,microstructure and strength of the brazed joint. The problems needed to further study have also been pointed out in the present paper.

关 键 词：ALN陶瓷 活性钎料 界面反应 钎焊工艺 

分 类 号：TG146.4[一般工业技术—材料科学与工程]