电流对SnBi共晶合金熔体/Cu反应偶界面反应的影响  

Effect of electric current on interfacial reaction of SnBi eutectic alloy melt/Cu reaction couple

作　　者：刘锡贝[1] 徐前刚[1] 

机构地区：[1]沈阳航空工业学院材料科学与工程学院,辽宁沈阳110136

出　　处：《沈阳航空工业学院学报》2010年第1期31-35,共5页Journal of Shenyang Institute of Aeronautical Engineering

摘　　要：研究了250℃条件下电流对SnBi共晶熔体/Cu/SnBi共晶熔体反应偶的界面反应的影响。实验结果表明未施加电流时SnBi共晶熔体/Cu反应偶界面反应产物为扇贝状的Cu6Sn5层和薄的Cu3Sn层。施加电流会促进SnBi共晶熔体/Cu反应偶界面反应层的生长。电流作用下SnBi共晶熔体/Cu/SnBi共晶熔体反应偶的阳极界面反应层厚度明显厚于阴极界面反应层厚度。The effect of electric current on the interracial reaction of SnBi eutectic alloy melt/Cu reaction couple at 250 ℃ was studied in this paper. The experimental results showed that the interracial reaction products of SnBi eutectic alloy melt/Cu reaction couple without applied electric current consist of the scallop - type Cu6Sn5 layer and thin Cu3Sn layer. Applied electric current would enhance the growth of interracial reaction layer of SnBi eutectic alloy meh/Cu reaction couple. The thickness of the anodic interracial reaction layer was thicker than that of the cathode interracial reaction layer in SnBi eutectic alloy melt/Cu/SnBi eutectic alloy melt reaction couple with applied electric current apparently.

关 键 词：SnBi合金 电流 电迁移效应 界面反应 

分 类 号：TG146.1[一般工业技术—材料科学与工程] TG146.2[金属学及工艺—金属材料]