SU-8光刻胶与Ni基底结合性的分子模拟  

Binding Property between SU-8 Photoresist and Ni Substrate by Molecular Dynamics Simulation

作　　者：杜立群[1] 郭照沛[1] 张晓蕾[1] 

机构地区：[1]精密与特种加工教育部重点实验室大连理工大学,辽宁大连116023

出　　处：《高分子材料科学与工程》2010年第3期168-171,共4页Polymer Materials Science & Engineering

基　　金：国家自然科学基金资助项目(50675025)

摘　　要：运用分子动力学模拟软件Materials Studio针对SU-8胶与Ni基底的结合性进行模拟分析,计算了不同前烘温度下SU-8胶与Ni(100)面的结合能,发现在343K的前烘温度下,光刻胶与基底的界面结合能达到最大,说明此时界面结合最好。通过对SU-8胶与Ni基底的相互作用能分析,发现影响结合能的主要因素是两种分子之间的范德华力,其中色散力起主要作用,其值是排斥力的近两倍。Molecular dynamics（MD）simulation software package Materials Studio was employed to calculate the binding energy between SU-8 photoresist and Ni substrate.Various binding energies between SU-8 photoresist and Ni substrate were calculated at different pre-bake temperature by MD simulation.The value of the binding energy achieved maximum at 343K.So it can draw the conclusion that the binding property is best at this pre-bake temperature.By analysing the interaction energy between SU-8 photoresist and Ni substrate,it can be found that the key influencing factor for the binding property is the van der Waals force between the two molecules.And the contribution of dispersive force in van der Waals force is the most important.The value of the dispersive force is twice as large as the value of the repulsive force.

关 键 词：SU-8光刻胶 Ni基底 结合能 分子动力学模拟 

分 类 号：TQ437.3[化学工程]