支持过程级动态软硬件划分的RSoC设计与实现  

Design and Implementation of RSoC for the Dynamic Hardware/Software Partitioning of the Function Level

作　　者：朱海[1] 李仁发[1] 陈宇[1] 刘彦[1] 

机构地区：[1]湖南大学计算机与通信学院,湖南长沙410082

出　　处：《计算机工程与科学》2010年第4期131-135,共5页Computer Engineering & Science

基　　金：国家863计划资助项目(2007AA01Z104);国家自然科学基金资助项目(60673061)

摘　　要：目前,可重构计算平台所支持的动态软硬件划分粒度多处于线程级或指令级,但线程级划分开销太大,而指令级划分又过于复杂,因此很难被用于实际应用之中。本文设计并实现了一种支持过程级动态软硬件划分的可重构片上系统(RSoC),提出了一种过程级硬件透明编程模型,给出了过程级的硬件封装方案;在分析软硬件过程根本区别的基础上,针对硬件过程开发了专门的管理模块,并利用部分动态重构等技术,实现了硬件过程的动态配置。实验表明该系统能够较好的支持过程级的动态软硬件划分,实现了节省资源、简化设计,提高性能等目的。At present, for most reconfigurable computing platforms, their dynamic hardware/software partitioning granularities are in the thread level or the instruction level. For the first one, the overhead is too much, and the second one is too difficult to realize. So both are too difficult to be implemented in practical applications. This paper presents and implements a reconfigurable system-on-chip （RSoC） which supports the dynamic hardware/software partitioning of the function level. A function level hardware transparent programming model is proposed, and the scheme to design hardware functions is given. Based on the essential differences between the hardware function and the software function, this paper develops a special management module for the hardware function, and implements the hardware function run-time reconfiguration by using the partial reconfigurable technology. Experiments show that the system can effectively support dynamic hardware/Software partitioning and achieve the objective of saving the resources, simplifying the design, improving the performance,and so on.

关 键 词：可重构片上系统 动态软硬件划分 硬件透明编程模型 

分 类 号：TP302[自动化与计算机技术—计算机系统结构]