工艺因素对SLA原型表面化学镀铜速率的影响  

Effects of Process Factors on Plating Rate of Electroless Copper Plating on Surface of SLA Prototype

作　　者：刘洪军[1] 李亚敏[1] 张俊[1] 马颖[1] 

机构地区：[1]兰州理工大学甘肃省有色金属新材料省部共建国家重点实验室,甘肃兰州730050

出　　处：《电镀与环保》2010年第2期22-26,共5页Electroplating & Pollution Control

基　　金：甘肃省自然科学基金(编号:2007GS04799);兰州理工大学优秀青年教师资助计划

摘　　要：化学镀铜可以作为SLA原型装饰防护或快速模具制造的表面处理方法。为优化化学镀铜工艺,考察了硫酸铜、还原剂、配位剂和添加剂以及温度和pH值等工艺因素对SLA原型表面化学镀铜速率的影响。结果表明:硫酸铜、pH值和乙二胺四乙酸二钠对镀铜速率的影响最大,而添加剂可以明显改善沉积铜层的质量和镀液的稳定性。综合考虑镀铜速率和镀液稳定性,得出了SLA原型表面化学镀铜的优化工艺。Electroless copper plating can be used as a surface treatment method for the decorative and protective coating of SLA prototype or the making of rapid tooling. To optimize electroless plating process, the effects of copper sulphate, reducer, complexing agents, addition agents, temperature and pH value on plating rate of electroless copper plating on the surface of SLA prototype were investigated. The results show that copper sulphate, pH value and disodium EDTA have the greatest impact on plating rate and the addition agents can remarkably improve the quality of plating copper layer and the stability of plating bath. With both of plating rate and bath stability taken into consideration, the optimum conditions are obtained for electroless plating of copper on surface of SLA prototype.

关 键 词：SLA原型 化学镀铜 工艺因素 沉积速率 

分 类 号：TQ153[化学工程—电化学工业]