Sb掺杂对锡铋近共晶钎料组织和力学性能的影响  

Effect of Sb doping on the microstructure and mechanical property of SnBi near-eutectic solder

作　　者：赵四勇[1] 蔡志红[1] 张宇鹏[1] 张宇航[1] 

机构地区：[1]广州有色金属研究院焊接材料研究所,广东广州510651

出　　处：《焊接技术》2010年第3期47-50,共4页Welding Technology

基　　金：广州有色金属研究院科技创新基金"低温丝状锡铋系焊料及助焊剂的研究与应用"资助项目(1683010)

摘　　要：为降低锡铋共晶钎料脆性、提高其伸长率,制备了Sn58Bi钎料合金,并通过Sb掺杂的方式对合金性能进行优化。对掺杂不同Sb含量合金的组织、熔化特性和拉伸力学性能的研究表明,Sn58Bi钎料组织较粗、成分偏析显著,适量Sb元素掺杂能够将其伸长率提高7%左右,同时合金的熔化特性仍能满足应用要求。对合金拉断试样的断口分析表明,Sn58Bi以脆性解理断裂为主,加入适量Sb元素时延性断裂的趋势增大,但当加入Sb过量时又向解理断裂转化。Sn58Bi near eutectic alloys were prepared with doping of Sb element,so as to reduce the fracture tendency of the alloy and increase the elongation rate under tensile condition.The microstructure,melting behavior and tensile capacity of the alloys were investigated and analyzed respectively.The results showed that coarse microstructure and composition segragation were the main inducements for the fragility of the Sn58Bi alloy.The elongation rate of the alloys could be improved 7%,the melting characteristics still could meet requirement when appropriate content Sb element dopped.Fracture analysis revealed that cleavage fracture was the main breaking mode for the Sn58Bi alloys.Despite the Sb doping could slightly turn the rupture mode and some features of ductile fracture appear on the ruptured cross-section,the rupture mode tansfered back to cleavage fracture eventually with the increasing doping content of Sb element.

关 键 词：无铅钎料 SnBi 力学性能 元素掺杂 电子元器件 

分 类 号：TG425[金属学及工艺—焊接]