Sn-9Zn-xP无铅焊料合金性能研究  

Study on the Properties of Sn-9Zn-x P Lead-free Solder Alloy

作　　者：黄惠珍[1] 魏秀琴[1] 帅歌旺[2] 周浪[1] 

机构地区：[1]南昌大学材料科学与工程学院,南昌330031 [2]南昌航空大学材料科学与工程学院,南昌330063

出　　处：《材料工程》2010年第3期4-7,12,共5页Journal of Materials Engineering

基　　金：江西省教育厅科技项目(GJJ09416)

摘　　要：以Sn-9Zn合金为研究对象,考察了P的添加对其性能的影响,并对其机制作了初步探讨。通过二次离子质谱(SIMS)分析发现,P的添加显著降低Sn-9Zn合金中的含氧量,从而提高了合金在Cu上的润湿性。P的改善润湿性的效果不仅有利于其工艺性能,也提高了Sn-9Zn/Cu焊点界面的结合强度,只使其塑性略有下降。同时,微量P的添加不改变Sn-9Zn合金与Cu形成的焊点的界面结构。另外,蠕变强度测试结果表明,P的添加能显著提高合金的抗蠕变性能。Effects of P addition on the properties of Sn-9Zn eutectic lead-free solder alloy have been studied.The results show that P could significantly improve the wettability of Sn-9Zn to Cu because P addition can decrease the content of oxygen in Sn-Zn alloy by the application of Secondary Ion Mass Spectrometry（SIMS） analysis.P addition enhances the creep strength of the Sn-9Zn bulk materials and the shear strength of Sn-9Zn/Cu joints,while decreases its ductility.No significant change in the interfacial structure of Sn-9Zn/Cu joints was observed by addition of P.The mechanisms were also discussed.

关 键 词：Sn-Zn合金 无铅焊料 P 润湿性 蠕变 

分 类 号：TG146[一般工业技术—材料科学与工程]