本底真空度对磁控溅射Cr/C镀层微观形貌及结合强度的影响  

Effect of the basic pressure on the microstructure and adhesion strength of Cr/C coatings by magnetron sputtering

作　　者：李洪涛[1] 蒋百灵[1] 陈迪春[1] 曹政[1] 蔡敏利[1] 苗启林[1] 

机构地区：[1]西安理工大学材料学院,陕西西安710048

出　　处：《功能材料》2010年第3期523-526,共4页Journal of Functional Materials

基　　金：国家高技术研究发展计划(863计划)资助项目(2005AA33H010)

摘　　要：采用闭合场非平衡磁控溅射离子镀技术于不同本底真空度下制备了Cr/C镀层。利用TEM、划痕仪分析了不同真空度下镀层微观截面形貌与结合强度的变化。结果表明,随本底真空度的降低,Cr/C镀层中物理混合界面层和Cr金属打底层的厚度显著减小;镀层结合强度随本底真空度的降低显著下降,物理混合界面层、Cr金属打底层厚度的减小以及镀层表面孔洞等缺陷增多、致密度变差等共同导致了其结合强度的下降。Cr/C coatings were deposited under different basic pressure using closed field unbalanced magnetron sputter ion plating technique.Cross section micrographs and adhesion strength of the coatings were analyzed by TEM and scratch tester.The results show that：both the thickness of physical mixed interface layer and Cr bond layer was reduced significantly with the basic pressure decreased.Adhesion strength of coatings was diminishing with the basic pressure decreased.The increase in thickness of physical mixed interface layer and Cr bond layer and defects in surface such as holes and denseness reduced were the main reasons.

关 键 词：本底真空度 物理混合界面层 Cr金属打底层 结合强度 

分 类 号：TB43[一般工业技术]