铜/钼/铜电子封装材料的轧制复合工艺  

Rolling Cladding Technology of Cu/Mo/Cu Electronic Packaging Material

作　　者：程挺宇[1] 熊宁[2] 吴诚[2] 秦思贵[2] 凌贤野[2] 

机构地区：[1]上海宝钢工程技术公司,上海201900 [2]安泰科技股份有限公司难熔材料分公司,北京100081

出　　处：《机械工程材料》2010年第3期38-40,共3页Materials For Mechanical Engineering

摘　　要：采用不同轧制复合工艺制备了铜/钼/铜复合板;利用超声检测仪、万能材料试验机等研究了首道次压下率和退火温度对复合板结合强度及热导率的影响,在此基础上确定了其轧制复合工艺。结果表明:采用首道次压下率为60%、退火温度为700℃、保温时间为60 min的是较理想的工艺,其界面结合强度可达到80 N.mm-1,其厚度方向的热导率为210 W.m-1.K-1。Cu/Mo/Cu cladding plates were prepared by different rolling cladding technologies. The effects of the first pressing ratio and annealing temperature on bonding strength and thermal conductivity Of the cladding plates were analyzed by means of ultrasonic detector and universal testing machine. The rolling cladding technology was obtained. The results indicate that the best process was first pressing ratio 60%, annealing temperature 700℃ and holding time 60 min. The interface bonding strength reached 80 N. mm^-1 and thermal eofiduetivity in thickness direction was 210 W· m^-1·K^-1.

关 键 词：电子封装材料 退火 压下率 铜 钼 

分 类 号：TG335.22[金属学及工艺—金属压力加工]