一种用于化学机械抛光的加压装置设计研究  

Research and Design on a Device to Apply Down-force in Chemical Mechanical Polishing Process

作　　者：王彩玲[1] 康仁科[1] 金洙吉[1] 

机构地区：[1]大连理工大学精密与特种加工教育部重点实验室,大连116024

出　　处：《中国机械工程》2010年第7期839-842,864,共5页China Mechanical Engineering

基　　金：国家自然科学基金资助项目(50390061)

摘　　要：low-k材料的使用,使低下压力技术成为化学机械抛光(CMP)设备研发设计必须面临的关键技术之一,为适应该需求,提出了弹性组合元件加压技术,即通过改变加压元件的变形量来实现压力调整的机械调压技术。对该加压模式的设计要求及加压精度进行了理论分析,并进行了加压精度及压力-变形线性关系的实验验证。实验所得的加压精度与理论分析结果比较接近,加压装置的压力与变形之间基本呈线性关系。加压元件可以实现压力从零开始的低下压力、高精度压力调整。With the use of low--k material, low down--force CMP has been a crucial technology for the equipment design. The technology of elastic compound elements was promoted to meet the needs of the low down--force. The assembly of the elastic element applied down--force in mechanical model. And down--force on the wafer was controlled by deformation of the pressure element. Re- quirements and the accuracy of pressure element were analyzed in theory, and the experimental results tallies basically with it. Also the down--force was in linear to the deformation of it. The pressure ele- ment can be regulated from zero in high precision under the low down force.

关 键 词：化学机械抛光 低下压力 弹性组合元件 加压元件 

分 类 号：TN305[电子电信—物理电子学] TH122[机械工程—机械设计及理论]