基于LS-DYNA的电脑主板跌落仿真分析  

Drop Simulation Analysis of Computer Mainboard Based on LS-DYNA

作　　者：黄涛[1] 朱若燕[1] 李厚民[1] 

机构地区：[1]湖北工业大学土木工程与建筑学院,武汉430068

出　　处：《中国印刷与包装研究》2010年第2期57-60,共4页China Printing Materials Market

摘　　要：在产品开模前进行跌落仿真,可以迅速、准确地得到产品应力、应变等各种参数,进而对其安全性进行分析,从中发现可能存在的设计问题。本文通过有限元软件LS-DYNA分析电脑主板在跌落过程中的动态响应。采用带失效模式的随动塑性本构模型,以不同跌落方式、不同跌落角度对该主板进行了仿真分析。所得结论可为类似主板的设计及包装防护设计提供有益的参考。Drop simulation before product mould opening can help to obtain the parameters including stress and strain, and analyze its safety, which can find the existing design questions. In this paper, dynamic properties of a computer mainboard during drop process were investigated by using FEA software LS-DYNA. Kinematic plastic constitutive model with failure mode was used to simulate the dropping of the mainboard with different drop ways and different drop angles. The conclusions can be used as a reference for product design and packaging design.

关 键 词：有限元分析 跌落仿真 动态响应 

分 类 号：TB487[一般工业技术—包装工程]