P型Bi_2Te_3基热电材料直接电镀镍  

Direct Electro-plated Nickel on P-type Bi_2Te_3 based Thermoelectric Materials

作　　者：李兴[1,2] 张艳华[1,2,3] 吴荣归[1,2] 徐桂英[1,2] 

机构地区：[1]北京科技大学特种陶瓷与粉末冶金研究所,北京100083 [2]北京新能源材料重点实验室,北京100083 [3]装备指挥技术学院,北京102249

出　　处：《材料科学与工程学报》2010年第2期300-303,共4页Journal of Materials Science and Engineering

摘　　要：采用常温硫酸镍电镀溶液研究了不同阴极电流和不同电镀时间对P型Bi2Te3基热电材料电镀镍层的显微结构和结合性能的影响。对镍层的形貌、厚度、成分以及与Bi2Te3基体之间的接触电阻进行了表征。研究结果表明在选定实验条件下,电流密度为1.0A/dm2,沉积时间为6分钟时界面电阻为最小值1.804Ω。The microstructures and binding properties of nickel films electro-plated on P-type Bi2Te3 based thermoelectric materials under different cathode currents and different plating time were studied.The morphology,the thickness and the composition of the nickel films,and the interface resistance between nickel film and P-type Bi2Te3 base were characterized.The results show that on the selected experimental conditions,the minimum interface resistance value is 1.804Ω when the current density is 1.0A/dm2 and the deposition time is 6 minutes.

关 键 词：电镀镍 热电材料 BI2TE3 

分 类 号：TB34[一般工业技术—材料科学与工程]