Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films  

作　　者：Wei Liu Lei Zhang J.K. Shang 

机构地区：[1]Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences Shenyang 110016, China [2]Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801 USA

出　　处：《Journal of Materials Science & Technology》2010年第3期200-205,共6页材料科学技术（英文版）

基　　金：supported by the National Natural Science Foundation of China(No.50501022);the National Basic Research Program of China(No.2004CB619306)

摘　　要：The thermodynamic conditions for dewetting of a liquid solder drop on copper thin films were examined under a hot-stage optical microscope in a flowing protective atmosphere.Dewetting of liquid solder was found to depend strongly on the copper film thickness and preceded by spalling of Cu 6 Sn 5 intermetallic compounds.However,the loss of interfacial bonding by spalling was not sufficient to cause immediate dewetting of solder drops if the wetting tip was still strongly bonded to the copper film.By introducing a pinning force on the wetting front,a sufficient condition was found from a force balance analysis for dewetting of the liquid solder drop,in general agreement with the experimental results.

关 键 词：DEWETTING SOLDER SPALLING Film thickness 

分 类 号：O484.2[理学—固体物理] O484[理学—物理]