盐酸介质中组氨酸与抗坏血酸复配对铜的缓蚀作用  

Electrochemical Study on the Complex of Arginine and Antiscorbic Acid as Corrosion Inhibitors for Copper in HCL

作　　者：郑红艾[1] 沈莉莉[1] 

机构地区：[1]上海电力学院能源与环境工程学院,上海20009

出　　处：《上海电力学院学报》2010年第2期148-150,共3页Journal of Shanghai University of Electric Power

基　　金：上海市曙光计划项目(O5SG53);上海市重点学科资助项目(P1304);上海市科委能力建设项目(0816051260)

摘　　要：采用电化学交流阻抗法与极化曲线法进行实验,研究了组氨酸及其与抗坏血酸复配溶液在0.25 ml/L盐酸溶液中对铜的缓蚀效果.结果表明,各种浓度的组氨酸及其与抗坏血酸复配溶液对铜电极腐蚀的阴极反应都有抑制作用,且随着组氨酸浓度的增大,缓蚀效果增强.此外,各浓度复配溶液的缓蚀效果比单独使用组氨酸的缓蚀效果好.The inhibition effect and mechanism of Arginine for copper and compositional aminoacid of copper in 0.25 mol/L HCl are investigated by potentiodynamic polarization curves and electrochemical impedance spectroscopy （EIS）. It is showed that Histidine can retard the cathode process of the copper corrosion reaction. The compositional solutions also can retard the cathode process of the copper corrosion reaction and have better inhibition effect with the concentration （10^-5- 10^-3 mol/L） increasing, the inhibition efficiency of histidine and the compositional solutions are improved.

关 键 词：铜 缓蚀剂 组氨酸 抗坏血酸 

分 类 号：TG174[金属学及工艺—金属表面处理]