微波介质陶瓷材料的低温烧结  

Low-temperature Firing in Microwave Dielectric Ceramic Materials

作　　者：曾群[1] 霍良[1] 周永恒[1] 

机构地区：[1]华南师范大学信息光电子科技学院,广州510006

出　　处：《材料导报》2010年第9期24-27,共4页Materials Reports

基　　金：华南师范大学学术骨干与团队培养基金(G21028);"211"三期建设基金(S13240)

摘　　要：低温共烧陶瓷材料是目前微波介质材料发展的主流。综述了低温共烧陶瓷材料的性能要求和4种降低材料烧结温度的方法,并探讨了各种低温烧结途径的优点和不足,同时指出了目前低温共烧陶瓷材料研究中需解决的主要问题以及今后主要的发展方向。The low temperature coffired ceramic materials are the mainstream of the development of microwave dielectric ceramics. In this paper, the performance requests for low-temperature co-fired ceramics, four ways to de- crease the sintering temperatures are described. In addition, the advantages and disadvantages of each way to lower the sintering temperature are discussed. Also, the main problems and the development direction about the investiga- tion of the low-temperature co-fired ceramics are indicated in this paper.

关 键 词：微波介质陶瓷 低温共烧 固有烧结温度 

分 类 号：TQ174.758[化学工程—陶瓷工业]