键合金丝用高纯金的制备  

Preparation of High Pure Gold Used for Gold Bonding Wires

作　　者：杨国祥[1,2] 邓志明[1,2] 

机构地区：[1]贵研铂业股份有限公司 [2]昆明贵金属研究所,云南昆明650106

出　　处：《贵金属》2010年第2期54-56,共3页Precious Metals

基　　金：国家科技支撑计划项目(2007BAE26B02)

摘　　要：介绍了电解法制备高纯金的基本原理和试验过程,与其它方法相比较,方法具有工艺技术参数稳定、易控、产品的杂质元素含量低、质量稳定、易于批量化生产、流程短、成本低等优点,特别适合对高纯金需求量大的行业如键合金丝等生产的需要。。The high pure gold used for gold bonding wires was prepared by the electrolytic method. Com- pared with other methods, this method has many advantages, such as： the process technology parameters are stable and easy to control; the content of impurity elements in products is low; the quality is stable; mass production is easy to realize; production flow is short; and the cost is low. It is specially suited for industries having high demand for high pure gold, for example, gold bonding wires.

关 键 词：金属材料 高纯金 电解精炼 杂质元素 

分 类 号：TG146.31[一般工业技术—材料科学与工程]