SiCp/Al电子封装复合材料预制坯的制备  

Preparation of SiCp/A1 Electronic Packaging Composite Preforms

作　　者：饶有海[1] 邹爱华[1] 刘园[2] 

机构地区：[1]南昌航空大学,江西南昌330063 [2]江西现代职业技术学院,江西南昌330095

出　　处：《南昌航空大学学报（自然科学版）》2010年第1期30-34,共5页Journal of Nanchang Hangkong University(Natural Sciences)

摘　　要：文章研究了粘结剂的含量、成型压力和烧结工艺对SiCp预制坯性能的影响规律,结果表明:随着粘结剂含量的增加,预制坯中SiC颗粒的体积分数越来越小,抗压强度在粘结剂含量为30%时达到最大,随后缓慢下降;成形压力在10-25MPa之间时,随着成型压力的增大,预制坯中SiC颗粒的体积分数越来越大,其抗压强度也越来越大;在800℃以下烧结时,随着烧结温度的提高,预制坯中SiC颗粒的体积分数变得越来越小,但在800℃以后没有明显的变化,预制坯的抗压强度随着烧结温度的提高而增大,在1100℃时,效果最好。The effects of binder content, forming pressure and sintering processes on the particle volume fraction and strength of the preforms were investigated. The results show that the particle volume fraction of the preforms decreases while the strength of preforms increases with the increase of binder content, and the compressive strength of preforms comes up to a maximum value when the content of binder is 30% , then decreases slowly. The particle volume fraction and the compressive strength of preforms increase with forming pressure increasing when it is between 10 -25MPa. With sinter temperature increasing, the particle volume fraction of preforms decreases gradually below 800℃, but has not an obvious change at the temperature higher than 800℃. The compressive strength of preforms increases with sinter temperature increasing and reaches to the maximum at 1100℃.

关 键 词：烧结工艺 成型压力 粘结剂 

分 类 号：TB333[一般工业技术—材料科学与工程]