Au20Sn箔材焊料及其应用  

Au20Sn Solder Foil and Its Application

作　　者：黄亮[1] 陈卫民 安兵[1] 吴懿平[1] 

机构地区：[1]华中科技大学,湖北武汉430074 [2]广州先艺电子科技有限公司,广东广州511400

出　　处：《电子工艺技术》2010年第3期125-127,131,共4页Electronics Process Technology

基　　金：国家自然科学基金项目(项目编号:60876070)

摘　　要：使用单辊法制备Au20Sn箔材,通过XRD衍射仪测试其晶态结构和相组成;采用差热分析法(DTA)测试其熔化温度;应用环境扫描显微镜(ESEM)观察其常温下微观组织。对比了单辊法制备的金锡焊料和叠层法制备的金锡焊料焊接光纤接头和大功率LED固晶接头的显微结构。结果表明:单辊法工艺可以制备Au20Sn箔材,其物理性能和显微组织都与理论的Au20Sn焊料一致;单辊法制备的金锡焊料的焊接性能比叠层法制备的焊料好。Using the method of single- roller,Au20Sn solder foil was prepared. X -Ray Diffraction （XRD） was used to test its crystalline structure and phase composition;melting temperature was tested by Different Thermal Analysis（DTA） ;environmental scanning electron microscope （ESEM）was used to observe the microstructure of Au20Sn solder foil at room temperature. Besides, in order to study the difference of soldering property of the Au20Sn solder made by the method of single - roller and layer by layer, both types of solder are used to solder fiber joint and high - power LED. The results show that the method of single - roller can successfully manufacture this Au20Sn solder foil, and its physical property and microstructure are all consistent with theoretical Au20Sn solder; the process of single -roller is better than the method of layer by layer in the way of soldering property.

关 键 词：单辊法 Au20Sn 差热分析 大功率LED 焊接性能 

分 类 号：TN604[电子电信—电路与系统]