低银Sn-Ag-Cu无铅钎料的性能研究  

Study on Properties of Low-silver-content Sn-Ag-Cu Lead-free Solders

作　　者：徐金华 吴佳佳 陈胜 马鑫 

机构地区：[1]深圳市亿铖达工业有限公司,广东深圳518000 [2]东莞市亿铖达焊锡制造有限公司,广东东莞523500

出　　处：《电子工艺技术》2010年第3期141-143,157,共4页Electronics Process Technology

基　　金：广东省粤港基金项目(项目编号:2008A092000007-1)

摘　　要：使用银含量较低的Sn-Ag-Cu无铅钎料是降低焊料成本最直接有效的手段之一,但银含量降低后对钎料性能的影响尚缺乏系统报导。通过向Sn-Cu二元体系中加入不同比例的纯银,制备了一系列低银合金。研究了银含量对钎料的熔点、可焊性及溶铜性能的影响。通过拉伸试验研究了合金的强度及杨氏模量。综合考虑上述各项性能指标,Sn-0.5Ag-0.7Cu是具有最佳性价比的合金成分。Although the use of low - silver - content Sn - Ag - Cu solder is an effective way to reduce cost, the effect of decreased Ag content to the properties of solders hasn ＇t been systematiclly reported. In this study, different percentages of pure Ag are added into Sn - Cu binary system and a series of low - sil- vercontent alloys are prepared. The effect of Ag content on the melting point, solderability and copper dissolution property are studied. The strength and young＇s modulus of the alloys are studied by tensile test . After a comprehensive comparison , the alloy that has the best combination ,of property and cost is Sn -0. SAg -0.7Cu.

关 键 词：无铅钎料 熔点 润湿性能 溶铜量 强度 

分 类 号：TN604[电子电信—电路与系统]