热-力载荷作用下的多芯片模块布局优化设计  

Electronic components placement optimization under thermo-mechanical loads

作　　者：宋永善[1] 周惠群[1] 张卫红[1] 

机构地区：[1]西北工业大学现代设计与集成制造技术教育部重点实验室,西安710072

出　　处：《机械设计与制造》2010年第6期8-10,共3页Machinery Design & Manufacture

基　　金：西安应用材料创新基金资助(XA-AM-200705)

摘　　要：针对多芯片模块(Multi-Chip Module,MCM)内部裸芯片的布局设计问题,提出了考虑MCM整体散热性能和局部(粘接剂)热应力两个方面的综合优化方法。该方法采用有限元计算获得MCM的温度场与应力场,使用遗传算法进行优化搜索,同时充分考虑了预防芯片几何干涉的设计约束。所提出的方法为权衡MCM温度场与热应力提供了有效的设计工具,以五芯片MCM布局设计为例说明了方法的可行性。Present a MCM（Multi-Chip Module）layout optimization approach that takes into account the global heat dissipation and local peak stress.This approach employs the finite element method to evaluate the temperature and stress distributions over the MCM and the genetic algorithm to search for the layout optimization iteratively.Meanwhile,the non-overlapping between chips is considered as design constraint in the design procedure.The proposed approach provides an efficient tool for the compromising design of the temperature and thermal stress.A typical problem of 5-chip MCM layout design is finally dealt with to demonstrate the capability of the method.

关 键 词：多芯片模块 布局优化 热应力 有限元分析 遗传算法 

分 类 号：TH12[机械工程—机械设计及理论] TN43[电子电信—微电子学与固体电子学]