厚膜集成电路DC/DC电源热模拟及优化设计  

Thermal Simulation and Optimization of Thick-Film DC/DC Power

作　　者：陈镜波[1,2] 何小琦[2] 鲍恒伟[3] 

机构地区：[1]广东工业大学材料与能源学院,广州510075 [2]工业与信息化部电子第五研究所,广州510610 [3]中国电子科技集团公司第43研究所,合肥230023

出　　处：《半导体技术》2010年第6期603-606,共4页Semiconductor Technology

摘　　要：针对厚膜DC/DC电源的散热问题,基于实测结果,利用有限元法建立了其三维有限元模型,并模拟出实际工作条件下的温度场分布。分析了电源模块中发热元件的温升及相互的热耦合情况,研究了外壳与基板材料的选择对功率器件温度的影响。分析结果表明,选用导热系数大的外壳和基板材料都有利于降低芯片温度,基板的最佳厚度介于0.6～1.0 mm之间。Based on the measurement,a three-dimensional model was established by finite element method for the cooling problem of DC/DC power.And under the actual working conditions,temperature distribution was simulated.Heat rising of self-heating components in the module and thermal coupling among them were analyzed.The effects of different shell and substrate materials on temperature of power devices were studied.The results show that the bigger the heat conductivity coefficient of shell and substrate materials,the better the dissipation effect will be.The prime thickness range of substrate is 0.6-1.0 mm.

关 键 词：DC/DC电源模块 热可靠性 有限元法 热设计 

分 类 号：TN402[电子电信—微电子学与固体电子学] TN452