高温对金-铝系统电阻和强度的影响研究  

Study on Influence of High Temperature on Resistance and Strength of Au-Al System

作　　者：胡立雪[1] 秦岭[1] 

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2010年第3期436-439,共4页Microelectronics

摘　　要：在讨论金-铝键合系统失效机理的基础上,对高温条件下金-铝键合系统接触电阻和键合强度衰变情况进行研究。给出了金-铝系统接触电阻高温衰减曲线和破坏性键合拉力强度高温衰减曲线。通过对实验结果的分析,提出在设计中通过评估键合点工作温度来避免金-铝键合系统的可靠性隐患。Based on failure mechanism of Au-Al bonding system,contact resistance and bonding strength in high temperature were studied.Decay curves of contact resistance and bonding strength under high temperature were presented.Analyses were made on experimental results.It is concluded that Au-Al bonding reliability can be enhanced by estimating working temperature at bonding point.

关 键 词：金-铝系统 接触电阻 键合强度 高温衰减 

分 类 号：TN306[电子电信—物理电子学]