镀液pH值及浓度对铝基表面化学镀镍-磷镀层磷含量及镀速的影响  

Effects of pH Value and Concentration of Solution on P Content and Deposition Rate during Electroless Ni-P Plating on Aluminum Substrate Surface

作　　者：柏冬梅[1] 黄明亮[1] 

机构地区：[1]大连理工大学材料科学与工程学院,大连116085

出　　处：《机械工程材料》2010年第6期28-32,共5页Materials For Mechanical Engineering

基　　金："十一五"国家科技支撑计划资助项目(2006BAE03B02-2)

摘　　要：通过正交试验对比分析了镀液pH值,主盐、还原剂以及络合剂浓度等因素对铝基表面化学镀镍-磷镀层磷含量及镀速的影响。结果表明:镀液pH值的影响最主要,其次为主盐和还原剂浓度;对于选定成分的酸性(3.5≤pH≤6)镀液,随pH值的增大,镀层磷原子分数由22.5%(pH=3.5)逐渐减至12.6%(pH=6.0),而镀速随pH值的增大而增加,达到最大值21.0μm·h^(-1)(pH=5.0)后变化不大;镀层磷含量随主盐NiSO_4浓度增大而降低,随还原剂NaH_2PO_2浓度增大而增加,而主盐和还原剂浓度的增大都可增加镀速;最终获得了磷原子分数为15.2%、镀速达到21.0μm·h^(-1)的镀层。The effects of the factors including pH value, concentration of main salt, reductant and complexing agent of the solution on the deposition rate and P content of the electroless Ni-P plating on aluminum substrate surface were investigated by the orthogonal test. The results show that the effect of the solution pH value was the most significant, and it was followed by main salt concentration and reductant concentration. In the selected acid solution, with the increase of pH value in the range of 3. 5 to 6. 0, the P content in the solution decreased from 22. 5at%（pH=3. 5） to 12. 6at% （pH=6. 0）. And the deposition rate increased till the rate reached the maximum value of 21.0 μm·h-1 （pH=5.0）, and then it had little change. The P content decreased with the increase of main salt concentration of NiSO4, but increased with the increase of reductant concentration of Nat-Iz PO2. The deposition rate increased with the increase of the concentration of main salt and reduetant. An excellent Ni-P plating with 15. 2at% P and deposition rate of 21.0 μm·h-1 could be obtained.

关 键 词：化学镀 镍-磷镀层 磷含量 镀速 

分 类 号：TQ153.2[化学工程—电化学工业]