解决COG邦定工艺中的IC翘曲问题  

Solving IC Warpage Problem in COG Bonding Process

作　　者：何敬韬[1] 

机构地区：[1]上海交通大学,上海200063

出　　处：《现代显示》2010年第7期14-16,共3页Advanced Display

摘　　要：今天,各种电子设备在生活中日益普及,人们对于电子设备的要求已经不仅仅停留在功能上。轻薄化是电子设备发展的一个重要方向,随之而来的就是对液晶面板轻薄化的要求,而轻薄化会带来IC翘曲的问题。文章通过对IC翘曲的研究,得出了降低COG邦定中的主压温度并增高基座温度可以解决IC翘曲的结论。文中的结论对生产中COG邦定工艺的改善有很大作用,并且已经在企业生产中得以应用。Nowadays all kinds of digital equipments are widely used in our lives, and people need thinner and lighter digital equipment that is easier to carry, so thinner and lighter LCD is in need. Then IC warpage problem is and a conclusion that decreasing COG encountered. In this paper, IC warpage is studied bonding main-bond temperature and increasing backup stage temperature to improve warpage problem is made. The conclusion is helpfu for COG bonding process improvement and already implemented in production.

关 键 词：液晶显示 玻璃基芯片邦定 各向异性导电膜 IC翘曲 

分 类 号：TN141.9[电子电信—物理电子学]