纯铜的组织和纯度对其表面氧化影响  

Study on the Impact of Structure and Purity of Copper Oxidation

作　　者：丁雨田[1] 卢振华[1] 胡勇[1] 曹军[1] 许广济[1] 

机构地区：[1]兰州理工大学甘肃省有色金属新材料省部共建国家重点实验室,甘肃兰州730050

出　　处：《铸造技术》2010年第6期723-726,共4页Foundry Technology

基　　金：兰州市科技局计划资助项目(2009-1-9)

摘　　要：利用氧化增重实验对纯铜的表面氧化性进行研究,分析纯铜的组织和纯度对其氧化性能的影响。结果表明:单晶组织铜氧化速率与晶粒取向有关,单晶铜(100)晶面的氧化速率大于(111)晶面的氧化速率;多晶铜的氧化速率处于单晶铜(100)晶面与(111)晶面氧化速率之间。纯铜的氧化速率与杂质原子类型和温度有关,纯度越高纯铜氧化速率越小。The surface oxidation of copper is studied by using the oxidation live weight gain experiment. The impact of the structure and purity of copper on its oxidation rate is analysed. The results showed that： The oxidation rate of single crystal copper relate to the grain orientation. The oxidation rate of single crystal copper with grain orientation of （100） crystal face is greater than that of （111 ） crystal face. The oxidation rate of polycrystalline copper is between the single crystal copper oxidation rate of （100） crystal face and （111） crystal face. The oxidation rate of pure copper is related with the type of impurity atoms and the temperature. The higher purity, the stronger antioxidation of copper.

关 键 词：单晶铜 多晶铜 纯度 氧化速率 

分 类 号：TG146.11[一般工业技术—材料科学与工程]