一种Snake算法在PCB板SEM分析中的应用  

Missile Electronical PCB SEM Analysis Based on New Snake Algorithm

作　　者：游培寒[1] 肖圣敏[1] 祝逢春[1] 葛贤坤[1] 

机构地区：[1]中国人民解放军95856部队

出　　处：《弹箭与制导学报》2010年第3期251-252,共2页Journal of Projectiles,Rockets,Missiles and Guidance

摘　　要：测量电路板焊接界面IMC厚度是电子器件扫描电子显微镜(SEM)分析的重要环节。文中采用Snake算法检测IMC介质边缘,再测算其厚度,该算法测定边缘准确方便,应用于某型空地导弹电子部件可靠性试验,得到了较好效果。Scanning electron microscope（SEM） analysis is an important method of calculating reliability of PCB. It detects the intermetallic compounds＇ （IMC）thickness of PCB to get its life span. In this paper, the Snake algorithm was used to detect the 1MC boundary and get its thickness. The new algorithm is proper and convenient, it was used in some air-to-ground missile PCB reliability analysis, and a good measurement result was obtained.

关 键 词：SNAKE算法 SEM IMC 空地导弹 

分 类 号：TJ760.5[兵器科学与技术—武器系统与运用工程]