IC引线键合头运动轨迹仿真研究  

Simulation of the Motion Trajectory of Wirebonding for IC

作　　者：张玲莉[1] 

机构地区：[1]天津城市建设学院能源与机械工程系,天津300384

出　　处：《武汉理工大学学报》2010年第11期100-104,共5页Journal of Wuhan University of Technology

摘　　要：选用塑性变形梁BEAM23单元建立有限元模型,通过对引线分阶段分步施加位移载荷模拟键合头的运动轨迹,求解得到相应的引线轮廓形状。仿真与实验结果接近,仿真省时、成本低,可满足参数优化的要求。文章进一步应用仿真分析对比了键合头运动轨迹中3种不同反向段形式下的引线轮廓成形。结果表明,反向段有利于引线理想轮廓颈部的形成,并能减轻引线轮廓的下垂;应用2个塑性变形段更有利于理想轮廓颈部的形成,且轮廓的高度有所减小。Wirebonding is a significant part in IC packaging.Solving the wire loop profile for given capillary trajectory is critical for capillary trajectory planning,in which nonlinearity mainly caused by plastic-elastic forming is a challenging work.Conventional solutions by statistical experiment and existing Linkage-spring model are expensive or time-consuming,and cannot meet the iterative operations required by further trajectory optimization.In this paper a finite element model has been proposed to simulate the wire loop profiling,in which BEAM23 has been selected as calculating unit,and the trajectory of capillary is divided into many displacement loads and applied on the wire step by step.Good agreement between simulated and actual wire profiles is obtained.Finally,three basic performs for wirebonding are simulated and analyzed,and the results show that perform,especially that with two plastic phases,can help to obtain ideal wire loop profile with better neck and less sagging.

关 键 词：键合头运动轨迹 轮廓成形 运动仿真 轨迹规划 

分 类 号：TP39[自动化与计算机技术—计算机应用技术]