Sn-9Zn-xCe钎料显微组织及钎焊性能的分析  

Microstructure and solderability of Sn-9Zn-xCe lead-free solder

作　　者：胡玉华[1] 薛松柏[1] 陈文学[1] 王慧[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《焊接学报》2010年第6期77-80,共4页Transactions of The China Welding Institution

基　　金：2006年江苏省"六大人才高峰"资助项目(06-E-20)

摘　　要：研究了添加稀土元素Ce对Sn-9Zn无铅钎料的润湿铺展性能、显微组织和焊点力学性能的影响.结果表明,Ce元素的加入改善了钎料的润湿铺展性能,质量分数为0.08%时,钎料的铺展面积达到最大,润湿性能最佳.随着Ce元素的加入,钎料的基体组织得到细化,富Zn相逐渐减少,当元素Ce的添加量大于0.08%时,钎料的显微组织中出现块状稀土元素Ce和Sn的金属间化合物.无铅钎料Sn-9Zn中稀土元素Ce的添加量为0.08%时,钎料焊点的力学性能最佳.Effects of rare earth element Ce added in Sn-9Zn solder on the microstructure and spreading property as well as mechanical properties were investigated. Results indicate that with the increase of the Ce from 0 to 0.08%,the microstructure is refined obviously and Zn-rich phrase is decreased. While the content of Ce exceeds 0.08%,small block Sn-Ce intermetallic compounds will appear. Results also show that with the increase of the Ce,the spreading property is improved,the spreading areas reaches maximum when the content of Ce is up to 0.08%,and the best mechanical properties of the soldered joints are achieved while the content of Ce is about 0.08%.

关 键 词：稀土元素CE 无铅钎料Sn-Zn 润湿铺展性能 力学性能 显微组织 

分 类 号：TG115.28[金属学及工艺—物理冶金]