Ag对Sn-Bi无铅钎料压入蠕变性能及显微组织的影响  

Effect of Ag on Indentation Creep Property and Microstructure of Sn-Bi Solder

作　　者：胡丽[1] 曾明[1] 张业明[1] 刘新刚[1] 沈保罗[2] 

机构地区：[1]西华大学材料科学与工程学院,四川成都610039 [2]四川大学材料科学与工程学院,四川成都610065

出　　处：《西华大学学报（自然科学版）》2010年第4期72-74,78,共4页Journal of Xihua University:Natural Science Edition

基　　金：四川省教育厅重点培育项目(07ZZ033)

摘　　要：对Sn-4.8Bi和Sn-4.8Bi-3.4Ag合金进行了压入蠕变试验,得到两种合金的蠕变曲线,分析了压入蠕变随载荷和温度的变化规律。利用X射线衍射(XRD)和扫描电镜(SEM)分别对合金的物相组成和蠕变前后的微观显微组织进行分析。结果表明:添加Ag元素可提高Sn-Bi合金钎料的抗蠕变性能。蠕变前,Sn-Bi合金中析出相为独立存在的颗粒状Bi,加入Ag后有条状和块状的Ag3Sn析出,且Bi析出减少;蠕变后,Sn-Bi合金中析出的Bi相变得细小并弥散分部于基体中,添加Ag后的合金中条状析出相变得细小,块状析出相变得粗大,但Bi相析出数量进一步减少。Creep curves were obtained by indentation creep test for Sn-4.8Bi and Sn-4.8Bi-3.4Ag alloy,and the changing rule of indentation creep with load and temperature was summarized.The chemical compositions of precipitated phases and the micro-structures before creep and after creep were analyzed by X-ray diffractometry（XRD） and scanning electron microscope（SEM）.The results show that the creep resistance of Sn-Bi solder is improved by adding Ag.The precipitated phase of Sn-Bi alloy is Biby contrasting the precipitated phases Ag3Sn and decreased Bi in Sn-Bi-Ag alloy before creep.The granular phase Bi is fine and forms diffuse distribution in the matrix during creep deformation in Sn-Bi solder.The stripy phase Ag3Sn is fine,the massive phase is coarse,but phase Bi further decreases in Sn-Bi-Ag solder after creep.The stripy phase and massive phase Ag3Sn containing Ag element and fined Bi play an important role for the improvement of the creep resistance of Sn-Bi-Ag alloys.

关 键 词：SN-BI合金 显微组织 压入蠕变性能 AG 

分 类 号：TG132.3[一般工业技术—材料科学与工程]