次亚磷酸钠还原化学镀铜工艺研究及展望  

Research and Prospects on Electroless Copper Plating Using Hypophosphite as Reducing Reagent

作　　者：吴婧[1] 王守绪[1] 张敏[1] 何为[1] 苏新 张佳 朱兴华 

机构地区：[1]电子科技大学微电子与固体电子学院,四川成都610054 [2]珠海方正科技多层电路板有限公司,广东珠海519060

出　　处：《印制电路信息》2010年第7期26-29,共4页Printed Circuit Information

摘　　要：化学镀铜是印制电路制作中重要工序,开发新的非甲醛体系化学镀铜工艺是当前化学镀铜领域中的热点。文章根据化学镀铜的基本原理,分析了以次亚磷酸钠为还原剂的化学镀铜工艺的特点、以及该技术的研究情况,并提出了该工艺未来的研究方向。Electroless copper plating is an important procedure in the production of printed circuit, so to develop a new electroless copper plating technology which uses non-formaldehyde system is a hotspot in recent electroless copper plating area. Based on the basic principles of electroless copper plating, this article analyzes the technique features and the research situation of the technology using hypophosphite as reducing agent, meanwhile, the future researching direction is brought forward.

关 键 词：化学镀铜 次亚磷酸钠 印制电路 表面修饰 

分 类 号：TN41[电子电信—微电子学与固体电子学]