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作 者:崔广云[1] 唐祯安[1] 汪家奇[1] 王雪峰[1]
机构地区:[1]大连理工大学电子信息与电气工程学部,辽宁大连116024
出 处:《热科学与技术》2010年第2期112-118,共7页Journal of Thermal Science and Technology
摘 要:作为打印机热性能分析以及优化热设计的基础,针对影响LED(light emitting diode)彩色打印机性能的内部发热问题,采用流体/传热软件对一款LED彩色打印机的内部温度场进行了数值模拟,得到了不同工作状态下的打印机内部的三维热场分布值,并分析了温度对关键部件的影响。设计了基于热电阻的温度测试系统对打印机内部进行了多点的温度测试,并将测试结果与仿真结果进行了对比,对稳态结果进行误差分析,对瞬态计算进行了温度变化过程对比,验证了数值模拟的准确性。As a basis of thermal analysis and thermal design,the temperature field inside a LED printer,which has an great influence on the performance of the printer,was analyzed numerically with CFD/heat transfer software in this paper.3-D temperature distributions inside the printer under different working conditions were obtained.Effects of the temperature on key components were analyzed.A temperature test system based on thermal resistance was designed to measure the inner temperature when printer works,comparisons between measurement and simulation under both steady and transient state demonstrate that the measurement results show good agreement with the simulated results.
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