多领域仿真平台下自顶向下的建模机制  

A Top-down Modeling Mechanism in Multi-domain Modeling and Simulation Platform

作　　者：王书亭[1] 吴义忠[1] 

机构地区：[1]华中科技大学国家CAD支撑软件工程技术研究中心,武汉430074

出　　处：《计算机辅助设计与图形学学报》2010年第7期1223-1229,共7页Journal of Computer-Aided Design & Computer Graphics

基　　金：国家"高档数控机床与基础制造装备"科技重大专项(2009ZX040001-015);国家"八六三"高技术研究发展计划(2006AA04Z121);国家自然科学基金(50775084)

摘　　要：针对当前多领域仿真平台建模机制采用拖放式建模、不支持产品正向设计的问题,提出基于空部件的自顶向下建模机制.该机制融合自底向上建模方式,以方便建立复杂多领域层次化模型,同时阐述了空部件的接口设计以及自底向上的模型更新机制.最后结合实例说明了采用该机制建立复杂多领域模型的过程.The bottom up modeling approach based on the traditional drag-and-drop modeling method employed in most of current multi-domain modeling platforms can not support the forward design. A top-down modeling mechanism based on empty components is presented to model multi-level abstract expression of complicated products easily. The interface of empty component and update process of models are discussed respectively. A simulation instance adopting the proposed mechanism to model complicated multi-domain problem is given.

关 键 词：正向设计 多领域建模 自顶向下 接口 自底向上 

分 类 号：TP391.9[自动化与计算机技术—计算机应用技术]