电子封装材料的研究现状及趋势  

Research progress and trends of electronic packaging materials

作　　者：汤涛[1] 张旭[1] 许仲梓[1] 

机构地区：[1]南京工业大学材料科学与工程学院,江苏南京210009

出　　处：《南京工业大学学报（自然科学版）》2010年第4期105-110,共6页Journal of Nanjing Tech University(Natural Science Edition)

基　　金：江苏省高校自然科学研究基金资助项目(01KJB430002)

摘　　要：电子信息产业高速发展,电子产品趋于小型化、便携化、多功能化.电子封装材料也随之迅速发展,已成为一种高新产业.介绍了电子封装材料的概念、作用和分类,分析总结了近年来国内外电子封装材料的生产研究现状,比较了陶瓷基、塑料基和金属基封装材料的特点,最后展望了电子封装材料的发展趋势.Electronic-information industry and electronic packaging materials as well,were developing rapidly,and electronic products tended to smaller,portable-oriented,and multi-functional.After the introduction to the concept,role and classification of electronic packaging materials,the production and the research of electronic packaging materials over the past decade at home and abroad were analyzed and summarized;the characteristics of ceramic-matrix,polymer-matrix and metal-matrix packaging materials were compared;and the developing trend of electronic packaging materials was proposed.

关 键 词：封装材料 陶瓷基 塑料基 金属基 

分 类 号：TM28[一般工业技术—材料科学与工程]