化学镀镍中络合反应的热力学过程分析  

Thermodynamic Study of Complexing Process in Nickel Electroless Plating

作　　者：蒋柏泉[1] 胡淑芬[1] 刘玉德[1] 曾江南[1] 

机构地区：[1]南昌大学环境与化学工程学院,江西南昌330031

出　　处：《南昌大学学报（工科版）》2010年第2期127-130,144,共5页Journal of Nanchang University(Engineering & Technology)

摘　　要：建立了化学镀镍中多元酸性络合剂与镍盐络合过程的热力学通式模型。以吉布斯自由能ΔG值为判据,通过该模型分别对乳酸、琥珀酸、硼酸和焦磷酸等4种络合剂的络合过程进行了热力学计算和影响因素分析。结果表明,在一定的条件下,ΔG值与pH值成正比,与温度（ΔG≤0时）和络合率成反比,与络合剂电离常数和元数的相互约束有关。在温度65~95℃和络合率65%~99%范围内,当ΔG=0时,使用上述4种络合剂的镀液pH值应分别小于4.9~6.6、5.4~6.2、12.4~12.9和5.2~5.7。The thermodynamic general formula model of complexation reaction between multiple acid complexing agent and nickel salt in Ni electroless plating process was established.The thermodynamic calculations and influence factor analysis of the complexation process for lactic acid,succinic acid,boric acid and pyrophosphate were carried out based on Gibbs free energy as a criterion through the model.The results showed that under certain conditions,ΔG was proportional to pH value,inversely proportional to temperature（when ΔG ≤0） and complexation rate and related to mutually restricted ionization constant and hydrogen element number of the acidic complexing agent.The bath pH value range of the four agents were 4.9 ~ 6.6,5.4 ~ 6.2,12.4 ~ 12.9 and 5.2 ~ 5.7 when ΔG=0 within temperature range of 65~ 95 ℃ and complexing rate range of 65%～99% range,respectively.

关 键 词：化学镀 镍 热力学 络合反应 

分 类 号：TQ153.2[化学工程—电化学工业] TQ153.3