无机填料粒子的几何特征对环氧树脂灌封胶导热性能的影响  

Influences of geometrical characteristic of inorganic fillers particles on thermal conductivity of EP encapsulating adhesive

作　　者：何兵兵[1,2] 傅仁利[1] 江利[2] 石志想[1] 俞晓东[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,江苏南京210016 [2]中国矿业大学材料科学与工程学院,江苏徐州221116

出　　处：《中国胶粘剂》2010年第7期20-24,共5页China Adhesives

基　　金：国家自然科学基金资助项目(50872054)

摘　　要：以Al2O3、Si3N4、BN、SiO2和AlN五种无机填料作为环氧树脂(EP)灌封胶的导热填料,研究了填料的种类、粒径大小和颗粒形态等对EP灌封胶热导率的影响。结果表明:EP灌封胶的热导率随着导热填料用量的增加而增大;当φ(BN)=35%(相对于总体积而言)时,相对最大热导率为2.12 W/(m·K),其值约为EP基体的10倍。填料粒子的几何特征对EP灌封胶的导热性能具有较大的影响;当Al2O3粒径为48μm时,EP灌封胶的相对最大热导率为1.3 W/(m·K);填料粒子过大或过小都会降低EP灌封胶的导热性能。层片状填料粒子可以获得较大的堆积密度,在EP灌封胶中能有效形成导热通道,增加其热导率。With five kinds of inorganic fillers （such as Al2O3, Si3N4, BN, SiO2 and AlN ） as thermal conductive fillers of epoxy resin （EP） encapsulating adhesive, so influences of some factors （such as the types, size and shapes for the fillers particles） were investigated on the thermal conductivity of EP encapsulating adhesive. The results showed that the thermal conductivity of EP encapsulating adhesive was increased with increasing thermal conductive fillers contents. The relative maximal thermal conductivity of EP encapsulating adhesive,which was about ten times more than of EP matrix,was 2.12 W/（m·K） when the volume fraction of BN was 35% in total volumes. The geometrical characteristic of fillers particles had great influence on the thermal conductivity of EP encapsulating adhesive, and its relative maximal thermal conductivity was 1.3 W/（m· K） when size of Al2O3 particles was 48 m, but its thermal conductivity was reduced when size of fillers particles was oversize or undersize. The lamellar fillers particles could availably enhance thermal conductivity of EP encapsulating adhesive because lamellar fillers particles had biggish bulk density, and could fashion better thermal conductive channels in EP encapsulating adhesive.

关 键 词：导热填料 环氧树脂 灌封胶 几何特征 热导率 

分 类 号：TQ433.437[化学工程]