微胶囊自修复技术及其在粘接涂层中的应用  

Self-healing technology based on microcapsule and its application in bonding coatings

作　　者：邢瑞英[1] 张秋禹[1] 吉志强[1] 孙九立[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710072

出　　处：《中国胶粘剂》2010年第7期49-53,共5页China Adhesives

基　　金：国防基础科研项目

摘　　要：将微胶囊加入到粘接涂层底漆中,赋予粘接涂层自修复的性能,从而延长其使用寿命,由此开创了智能粘接涂层的新领域。介绍了微胶囊自修复技术、微胶囊的自修复机理和微胶囊的种类,着重阐述了微胶囊自修复技术在粘接涂层中的应用研究现状,并对自修复微胶囊粘接涂层的研究前景进行了展望。The bonding coatings had self-healing ability and longer length of life when a microcapsule was introduced into priming of bonding coatings, so a new field of smart bonding coating was created. The microcapsule self-healing technology and mechanism as well as microcapsule types were introduced. The research actuality of microcapsule self-healing technology,which was used in bonding coatings,was emphatically summarized. The research prospect of self-healing microcapsule bonding coating was expected.

关 键 词：微胶囊 自修复 机理 粘接涂层 

分 类 号：TQ630.7[化学工程—精细化工]