SiC陶瓷与TiAI合金的真空钎焊  

VACUUM BRAZING OF SiC CERAMIC TO TiAl ALLOY

作　　者：刘会杰[1] 李卓然[1] 冯吉才[1] 钱乙余[1] 陶秋燕[2] 赵正伟 

机构地区：[1]哈尔滨工业大学,150001 [2]北京联合大学机械工程学院,100020 [3]大庆石油化工设计院,160000

出　　处：《焊接》1999年第3期7-10,共4页Welding & Joining

基　　金：国防科技预研基金;哈工大校管基金;焊接国家重点实验室开放课题资助项目

摘　　要：采用Ag-Cu-Ti钎料对常压烧结的SiC陶瓷与TiAl金属间化合物进行了真空钎焊,并对接头的微观组织和室温强度进行了研究。结果表明,利用Ag-Cu-Ti钎料可以实现SiC与TiAl的连接;接头界面具有明显的层状结构,即由Ti-Cu-Si合金层、富Cu相与富Ag相的双相层和Ti-Al-Cu合金层组成;在1173K和10min的钎焊条件下,接头室温剪切强度达到173MPa。The vacuum brazing of pressureless - sintered SiC ceramic to TLAl intermetallic compound was carried out by Ag - Cu-Ti brazing filler metal. The microstructures and strength of the joints were investigated. The experimental results showed that the bonding of SiC to TLAl can be accomplished by Ag - Cu - Ti brazing filler metal. Between SiC and TiAl an interfacial structure occurs, that is clearly composed of Ti - Cu - Si alloy layer, Cu - rich and Ag - rich alloy layer and Ti - Al - Cu alloy layer. The shear strength of the joint, which was brazed at 1173 K for 10 min, is up to 173 MPa at room temperature.

关 键 词：陶瓷 TIAL合金 真空钎焊 焊接 碳化硅 

分 类 号：TG454[金属学及工艺—焊接] TQ174.1[化学工程—陶瓷工业]