银包铜粉环氧导电胶的制备、结构与性能  

Preparation,structure and performance of silver-plating copper filled epoxy conductive adhesive

作　　者：杜亮亮[1] 周震涛[1] 林学好 袁冯福[2] 潘慧铭[1] 

机构地区：[1]华南理工大学材料科学与工程学院,广东广州510640 [2]深圳美信电子有限公司,广东深圳518053

出　　处：《粘接》2010年第8期38-41,共4页Adhesion

摘　　要：为了研制性能优良的导电胶,选用双酚A型环氧树脂作为基体、四乙烯五胺作为固化剂、银包铜粉为导电填料、AA-75作为分散剂,制备了银包铜粉导电胶。使用直流低电阻测试仪测定了导电胶的体积电阻率;用红外光谱对添加不同量固化剂的导电胶进行了分析,用差示扫描量热仪对加入固化剂后的固化反应情况进行了测试。在最佳配比和最佳工艺条件下所制备的导电胶的体积电阻率达到8.9×10-4·Ωcm。In this paper, using bisphenol A epoxy resin as the matrix, TEPA as the curing agent, silver-plating copper powder as the conductive filler and AA-75 as the dispersant, the silver plating copper filled epoxy conductive adhesive was prepared. DC low-resistance tester is used to measure the volume resistivity, infra-red spectrometry is used to characterize the adhesives with different amount of curing agent and differential scanning calorimetry is used to determine the optimal curing reaction temperature. The result showed that under the optimal proportions and process conditions the volume resistivity of conductive adhesive is 8.9 × 10^- 4 Ω · cm.

关 键 词：导电胶 环氧树脂 银包铜粉 体积电阻率 

分 类 号：TM24[一般工业技术—材料科学与工程] TQ433.437[电气工程—电工理论与新技术]