塑封半导体器件的可靠性保证措施  

Assurance Measures for Reliability of Plastic Semiconductor Components

作　　者：张臻鉴[1] 刘文媛[1] 

机构地区：[1]中国航空计算技术研究所,陕西西安710068

出　　处：《现代电子技术》2010年第16期164-165,174,共3页Modern Electronics Technique

摘　　要：为了降低塑封半导体器应用于高可靠性产品领域中的质量风险,采用质量细化分析方法,针对塑封半导体器件本身在材料、结构等方面的特点,做了塑封半导体器件失效模式与机理的原理探讨。得出器件应用于产品前,应该进行温度适应性评估、二次筛选以及破坏性物理分析等先期工作。In order to reduce the application risk of the plastic semiconductor components used in the field of high-reliability products,the method of detailed analysis of quality is adopted,aiming at the material and structure characteristics of semiconductor components,some failure modes and principles of plastic semiconductor components are discussed.The conclusion is as follows：before the semiconductor components are applied to products,the temperature adaptability evaluation,the secondary screening and destructive physical analysis should be conducted.

关 键 词：塑封半导体器件 可靠性 温度适应性评估 二次筛选 破坏性物理分析 

分 类 号：TN304.05[电子电信—物理电子学]