平板显示器中应用ACF的驱动IC封装技术  

Driver IC Packaging Technologies using Anisotropic Conductive Films in Flat Panel Display

作　　者：王艳艳[1] 何为[1] 王守绪[1] 周国云[1] 陈浪 林均秀 莫芸绮 

机构地区：[1]电子科技大学应用化学系,四川成都610054 [2]珠海元盛电子科技股份有限公司技术中心,广东珠海519060

出　　处：《印制电路信息》2010年第8期60-62,70,共4页Printed Circuit Information

摘　　要：文章叙述了ACF(Anisotropic Conductive Film,各向异性导电膜)与驱动IC(Integrated Circuit,集成电路)芯片封装的历史,并强调了驱动IC封装在实现显示器微型化、高分辨率、低成本及高显示质量等方面的重要性。文章还对微细间距COF(Chip on Flex)连接用ACF的材料设计进行了介绍。文章指出低温固化ACF可以改善LCD(Liquid Crystal Display,液晶显示屏)模块的生产效率,降低大型LCD模块表面的热应力;同时指出COG(Chip on Glass)连接后LCD面板的翘曲变形引起LCD模块漏光事故。ACF焊接温度的降低可以有效减少翘曲变形,避免在应用COG封装大型LCD模块的驱动IC时所产生漏光。In this paper, the history of ACF and driver IC packaging are described. In addition, it is mentioned that how important driver IC packaging is in implementing in the product for miniaturization, high resolution, low cost and high display quality. ACF material design for COF which is advantageous in fine pitch interconnection is described. It is indicated that low temperature curable ACF is very useful in improving productivity of LCD modules and reducing the thermal stress at the interface in large LCD modules. We also indicate that the warpage of LCD panel after COG interconnection induces the light linkage issue in LCD modules. Lowering bonding temperature of ACF is also very important in reducing the warpage issue and avoiding the light linkage issue when COG is applied for driver IC packaging in large LCD modules.

关 键 词：各向异性导电膜 驱动集成电路封装 载带封装 微细间距封装 玻璃板上芯片封装 

分 类 号：TN41[电子电信—微电子学与固体电子学]