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作 者:李庆亮[1] 王伟民[1] 赵晓东[1] 王敏[1] 崔晓改[1]
机构地区:[1]中国电子科技集团公司第二研究所,山西太原030024
出 处:《电子工艺技术》2010年第4期237-240,共4页Electronics Process Technology
摘 要:光刻胶涂布的厚度和均匀性直接影响细微光刻电路图形的精度,对电子产品的集成度和合格率有着极为重要的影响。基于ITO玻璃基板涂胶工艺实验,研究了影响涂胶厚度和涂胶均匀性的各种因素,包括光刻胶黏度、涂胶辊表面结构、胶辊压入量和涂胶速度等。针对几种常见的典型涂胶缺陷进行了研究分析,并制定了相应的解决对策。The thickness and the uniformity of gelatinizing have direct impact on resolution of micro-lithography circuit pattern,and have strong impact on integration and yield of electronic products.The experiment about gelatinizing process based on the ITO glass was made.The various factors which have impact on film thickness and film equality were studied including the viscosity of the photoresist,the surface structure of adhesive roller,the extrusion quantity of gelatinizing rollers and the gelatinizing speed etc.Several typical defects of gelatinizing were analyzed,and the related countermeasures were put forward.
关 键 词:ITO玻璃基板 光刻胶 涂胶厚度 涂胶均匀性 涂胶缺陷
分 类 号:TN873[电子电信—信息与通信工程]
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