固结磨料抛光的平面度预测模型  

Flatness Forecast Model for Fixed Abrasive Polishing

作　　者：康静[1] 左敦稳[1] 孙玉利[1] 朱永伟[1] 

机构地区：[1]南京航空航天大学机电学院,南京210016

出　　处：《硅酸盐通报》2010年第4期768-774,共7页Bulletin of the Chinese Ceramic Society

基　　金：江苏省博士后科研资助计划项目(0901035C);中国博士后科学基金(200904501095)

摘　　要：本文利用Matlab建立了固结磨料抛光的平面度预测模型,根据硅片初始形貌及抛光参数值,可以预测抛光后硅片的表面形貌,并通过实验验证了该模型的可靠性。利用该模型分析了各抛光工艺参数对平面度的影响,结果表明:硅片和抛光垫转速不等时,硅片呈凸形,转速相差越大,平面度越差,但转速大小对平面度影响较小;增大偏心距有利于减小转速不等带来的影响,使平面度变好;选择较小的压力有利于平面度的提高。In this article, a flatness forecast model for fixed abrasive polishing was built using Matlab. According to the initial shape and polishing parameters, the surface topography after polishing can be predicted. And this model was verified by comparing the removal rate with experiment results. Using this model, the influence of different polishing parameters to flatness was studied. The results showed that while the rotational speed of wafer and polishing pad were unequal, the surface topography of the wafer after polishing was convex. The greater the speed different from each other, the worse the flatness, but the flatness did not change with the speed of the polishing pad. As the eccentricity increased, the impact of the unequal rotational speed became smaller, and better flatness can be got. ＂It was also found that low pressure can lead to get better flatness.

关 键 词：固结磨料抛光 平面度 去除速率 MATLAB 

分 类 号：TG74[金属学及工艺—刀具与模具]