颗粒增强铝基复合材料的制备及热膨胀性能  

Fabrication and thermal expansion properties of particle reinforced Al matrix composites

作　　者：栾佰峰[1] 裴英飞[2] 黄天林[1] 叶青[1] 黄光杰[1] 杨谦[1] 

机构地区：[1]重庆大学材料科学与工程学院,重庆400044 [2]大庆师范学院教育科学学院,黑龙江大庆163712

出　　处：《重庆大学学报（自然科学版）》2010年第8期136-142,共7页Journal of Chongqing University

摘　　要：以复合材料在电子封装方面的应用为目标,选择粒径大约为4μm的Al2O3、AlN和SiC颗粒,采用挤压铸造法方法制备了颗粒体积分数为40%的3种铝基复合材料。研究表明,所制备的复合材料组织致密,颗粒均匀分布。对比分析表明,复合材料的平均线膨胀系数(CTE)在11.51×10-6～18.62×10-6/K之间并随着加热温度的升高而增大。SiCp/2024复合材料的CTE实测值最低,AlNp/6061次之,Al2O3p/2024略高;Al2O3p/2024的实测值与Kerner模型预测值相符得较好,而AlNp/6061复合材料与ROM模型符合得较好,SiCp/2024复合材料的实测值介于Shapery模型的上下限之间。Aimed at electronic packaging application, the different types of particles of Al2O3, AlN and SiC which the mean size is about 4 μm are selected and three types of composites are fabricated by squeeze casting method with the particle volume fraction is 40%. The results show that the microstructure of composites is dense and free of pores with the particle distribute uniformly. The mean linear coefficient of thermal expansion （CTE） of composites ranges from 11.51×10^-6~18.62×10^-6/K and increases with increasing temperature. The measured coefficient of thermal expansion of SiCp/2024 is lower than that of AlNp/6061 and Al2O3p/2024. The measured CTE values of Al2O3p/2024 composites agreed well with Kerner’s model, the CTE of AlNp/6061 is closer to the prediction by ROM, and the CTE of SiCp/2024 varies from lower limit to upper limit of Shapery’s model.

关 键 词：线膨胀系数 复合材料 颗粒 电子封装 

分 类 号：TG146.23[一般工业技术—材料科学与工程]