LTCC基片的飞针测试工艺研究  

The technical Research of Flying Probe Test Manufacturing Process at Low Temperature Co-fired Ceramic(LTCC)

作　　者：王洪宇[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京东燕郊065201

出　　处：《电子工业专用设备》2010年第8期49-51,共3页Equipment for Electronic Products Manufacturing

摘　　要：低温共烧陶瓷技术(Low Temperature Co-fired Ceramic LTCC)是近年来兴起的一种相当令人瞩目的多学科交叉的整合组件技术,广泛用于基板、封装及微波器件等领域。主要介绍当前广泛用于检测混合电路板、LTCC陶瓷基板、PCB裸板故障的飞针测试设备在陶瓷基片测试中的工艺研究。The low temperature co-fired ceramic （LTCC）technology has already become an integrated technology of electric components, and is used of base plate、encapsulation and microwave components. this article mainly introduce the technical Research of using the flying probe for testing the defect of mixed circuitry、LTCC and PCB Board at Low Temperature Co-fired Ceramic（LTCC）.

关 键 词：LTCC基片 飞针测试 工艺研究 

分 类 号：TN407[电子电信—微电子学与固体电子学]