固结磨料研磨中去除机理探索  

Removal mechanism in fixed abrasive lapping process

作　　者：李茂[1] 朱永伟[1] 叶剑锋[1] 樊吉龙[1] 李军[1] 

机构地区：[1]南京航空航天大学江苏省精密与微细制造技术重点实验室,南京210016

出　　处：《金刚石与磨料磨具工程》2010年第4期1-6,共6页Diamond & Abrasives Engineering

基　　金：国家自然科学基金资助项目(No.50905086);国家自然科学基金资助项目(No.50675104)

摘　　要：结合目前实验室的实际加工条件建立了用FAP(fixed abrasive pad,固结磨料抛光垫)研磨抛光时磨粒嵌入工件表面的切深数学模型,提出了当不考虑抛光垫的弹性变形且FAP中添加的磨粒粒径范围在10～14μm之间时,磨粒压入工件的最大深度值在0.4μm左右。当考虑抛光垫的弹性变形时,磨粒嵌入工件的深度普遍减小,从而使得加工后工件的表面质量得到明显提高,主要表现在加工后工件表面划痕数量和划痕深度大大减小,表面粗糙度值降低。为了验证模型的正确性,在研磨抛光实验过程中收集了大量磨屑并对其拍摄大量SEM照片,通过图像处理和分析证明了在加工产生的磨屑中,91%以上(均值96.5%)的磨屑厚度小于0.3μm,非常好地吻合了本文中所建立的切深数学模型。According to the actual processing condition in laboratory,a mathematical model about depth of cut in lapping process was established. The model reveals that when the elastic deformation of fixed abrasive pad（FAP）is not considered and the abrasive grit size is ranged from 10 μm to 14 μm,the maximal depth of cut is about 0.4 μm; But the elastic deformation of FAP exists in the real lapping process,which causes the depth of cut decreased,thus the surface quality getting improved a lot. In order to inspect and verify the model,large numbers of abrasive dust were collected and analyzed through SEM photos.The results showed that over 91% abrasive dust thickness was smaller than 0.3 μm ,which was perfectly consistent with the model.

关 键 词：固结磨料抛光垫 研磨 去除机理 磨屑 

分 类 号：TG74[金属学及工艺—刀具与模具] TQ164[化学工程—高温制品工业]