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作 者:孙闻[1] 俞君[1] 沈一璋[1] 朱三根[1] 王小坤[1]
机构地区:[1]中国科学院上海技术物理研究所传感技术国家重点实验室,上海200083
出 处:《红外》2010年第9期18-22,共5页Infrared
基 金:上海技物所三期创新C2-41资助项目
摘 要:高气密激光封口技术是一种可用于金属管壳的封装技术。它能在高真空环境中使开有小孔的管壳器件实现封口密封,从而使排气工艺与封口工艺同步完成。针对微型管壳的结构和材料特点,研究了激光焊接设备的电流和脉宽与焊接能量的关系以及电流、脉宽和离焦量对封口质量的影响,得到了柯伐材料的激光封口参数,并将这些工艺参数应用到了红外探测器金属管壳的激光焊接中。测试结果表明,其漏率均优于1×10^(-10)Torr·l/s。Highly hermetical laser sealing is a packaging technology which can be used for metal packages.It can achieve the sealing of a small hole of the metal package containing an infrared detector in a high vacuum environment.Thus,both the exhaust process and the sealing process of the infrared detector assembly can be finished at the same time.According to the structure and material of a micro package,the relation of the current and pulse width of a laser welding equipment to welding energy and the influence of the current,pulse width and defocusing distance on welding quality are analyzed.Proper laser welding parameters are obtained for Kovar materials.With those parameters,the laser sealing of a hole of the metal package containing an infrared detector is achieved.The test result shows that its leak rate is better than 1×10^(_10)Torr·1/s.
分 类 号:TN215[电子电信—物理电子学]
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